| Low Dielectric Constant Materials for IC Applications |  | Creators: Paul S. Ho, Jihperng Leu, Wei William Lee
Publisher: Springer
Category: Book
List Price: $195.00
Buy New: $92.69
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You Save: $102.31 (52%)
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Seller: littlemabookstore
Sales Rank: 882,555
Languages: English (Unknown), English (Original Language), English (Published)
Media: Hardcover
Edition: 1
Pages: 309
Number Of Items: 1
Shipping Weight (lbs): 1.3
Dimensions (in): 9.7 x 6.4 x 0.7
ISBN: 3540678190
EAN: 9783540678199
ASIN: 3540678190
Publication Date: December 16, 2002
Availability: Usually ships in 1-2 business days
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Product Description
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.
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